Abstract
The need for high-κ gate dielectrics and metal gates for advanced integrated circuits has re-opened the door to germanium and III–V compounds as potential replacements for silicon channels, offering the possibility to further increase the performances of future CMOS generations, as well as adding new circuit functionalities. In this chapter, we discuss the most important issues related to high-mobility channels, and highlight recent advances in the field, focusing on promising approaches for the passivation of their interface with high-κ gate dielectrics, as required for the fabrication of high-performance inversion mode metal-oxide-semiconductor field effect transistors.
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Acknowledgments
We are indebted to our colleagues for their valuable contribution to this work: B. De Jaeger, A. Delabie, F. Bellenger, J. Mittard, F. Leys, B. Kaczer, T. Conard, M. Caymax, M. Meuris, G. Pourtois (IMEC), D. Brunco (Intel), G. Wilk (ASM), B. Yang (AMD), K.K. Ng (SRC), M. Hong (NTHU), Y. Xuan, H.C. Lin, Y.Q. Wu, T. Yang, T. Shen, M. Xu (Purdue), C.L. Hinkle, E.M. Vogel, and R.M. Wallace (UT Dallas). Stimulating discussions with Professor V.V. Afanas’ev, Professor A. Stesmans (KU Leuven), Professor J. Woodall, and Prof. M.S. Lundstrom (Purdue) are gratefully acknowledged. The work on Ge has been financially supported by the IMEC Industrial Affiliation Program on Ge and III–V devices, the European Project IST-ET4US-2048 “Epitaxial Technologies for Ultimate Scaling”. The work on III–V has been supported by US National Science Foundation and SRC FCRP MSD Center.
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Houssa, M., Ye, P., Heyns, M. (2013). High Mobility Channels. In: Kar, S. (eds) High Permittivity Gate Dielectric Materials. Springer Series in Advanced Microelectronics, vol 43. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-36535-5_12
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