Abstract
The grain-boundary diffusion (GBD) of germanium in copper and its alloys Cu-2% Ge and Cu-0.5% Fe is investigated in the temperature range of 500–590°C by means of electron-probe microanalysis. The GBD parameters (triple product P = sδD GB and effective activation energy E) are found. The temperature dependence of the triple product for germanium GBD in pure copper can be described by equation P = 3 × 1015exp[−80 kJ mol−1/(RT)] m3 s−1. It is shown that the addition of Ge has almost no effect on the GBD parameters in copper, while do** with iron leads to a considerable reduction in the triple product.
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Original Russian Text © Yu.A. Terent’ev, B.S. Bokstein, A.L. Pomadchik, D.E. Popova, A.O. Rodin, 2012, published in Izvestiya VUZ. Tsvetnaya Metallurgiya, 2012, No. 5, pp. 46–50.
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Terent’ev, Y.A., Bokstein, B.S., Pomadchik, A.L. et al. Grain-boundary diffusion of germanium in copper and Cu-Ge and Cu-Fe alloys. Russ. J. Non-ferrous Metals 53, 380–385 (2012). https://doi.org/10.3103/S1067821212050124
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DOI: https://doi.org/10.3103/S1067821212050124