Abstract
A novel, non-contact method for determination of ultra-shallow junction sheet resistance and leakage current density has been developed based on monitoring the dynamics of photo-generated carriers by means of spatially separated capacitive probes. At light modulation frequencies of about 100 kHz, spatially resolved surface voltage signals give a direct measure of the junction sheet resistance, independent of the junction depth. At lower light modulation frequencies, the junction leakage current density is determined. Combining capacitive monitoring of modulated photo-generated free carriers with a precision wafer motion stage allows for rapid acquisition of sheet resistance and leakage data for efficient wafer-scale map** applications.
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Faifer, V.N., Current, M.I., Walecki, W. et al. Non-contact Electrical Measurements of Sheet Resistance and Leakage Current Density for Ultra-shallow (and other) Junctions. MRS Online Proceedings Library 810, 68–73 (2003). https://doi.org/10.1557/PROC-810-C11.9
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DOI: https://doi.org/10.1557/PROC-810-C11.9