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Observation of Vacancy Clustering in Si Crystals During in Situ Electron Irradiation in a High Voltage Electron Microscope

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Abstract

The formation of vacancy clusters in various Si crystals covered with SiO2 and Si3N4 films has been studied by means of high-voltage and high-resolution electron microscopy using electron beam energies of 1000 and 400 keV, respectively, and at temperatures between 20 and 250°C. Small vacancy clusters of about 2–5 nm in the form of Frank dislocation loops and stacking fault tetrahedra were observed by irradiating the thinnest areas (< 20 nm) of the investigated silicon specimens. Vacancy clustering seems to be more complicated in the thicker parts (> 20 nm) of irradiated crystals. We assume that in these areas vacancy clusters may be formed only in Si layers near the interfaces Si-SiO2 or Si-Si3N4 and they may interact with interstitials without full recombination of the defects. This leads to the appearance of a new form of interstitial clusters such as {111}-defects as well as the usual interstitial {113}-defects associated with vacancy clusters during prolonged irradiation in the HVEM.

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Acknowledgments

The authors would like to thank Dr. A.K. Gutakovskii for valuable discussions and for his assistance with the experiments in the high resolution electron microscope. The research described in this paper was supported in part by grants NQP 000 and NQP 300 from the International Science Foundation and the Russian Government. Part of the work was also performed with financial support of the Belgian National Science Foundation (NFWO) in the frame of contract G.0297.95. L. Fedina is indebted to the Belgian Office for Scientific Technical and Cultural Affairs for her research fellowship.

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Fedina, L., Van Landuyt, J., Vanhellemont, J. et al. Observation of Vacancy Clustering in Si Crystals During in Situ Electron Irradiation in a High Voltage Electron Microscope. MRS Online Proceedings Library 404, 189–194 (1995). https://doi.org/10.1557/PROC-404-189

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  • DOI: https://doi.org/10.1557/PROC-404-189

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