Abstract
The thermal oxidation of Co alloy and Ni alloy thin films on top of Cu, has been studied as a function of film composition. Four different alloys were studied; CoWP, CoWB, CoMoB, and NiMoB. For the Co alloys, significant oxidation is observed after an air anneal above 350C, accompanied by Cu diffusion through the film to the surface. In contrast, for the NiMoB films, there is minimal oxidation of the surface even after a 400C anneal in air, and Cu diffusion through the film is greatly reduced. These results indicate that Ni-based barriers may be desirable in applications where self-aligned metal layers are used on top of Cu interconnects as a replacement for dielectric caps such as SiN and SiCN.
This is a preview of subscription content, log in via an institution to check access.
Similar content being viewed by others
References
D. Edelstein et al., IEDM Proc., 1997, p. 773.
T. Ko et al., VLSI Symp. Proc., 2003, p. 109.
C.-K. Hu et al., Microelec. Eng., 70, 406 (2003).
J. Gambino et al., AMC 2005 Proc., MRS, 2006, p. 151.
J. Gambino et al., IPFA Conf., 2005, p. 92.
J. Gambino et al., MRS Proc., vol. 863, 2005, p. 227.
A. Kohn et al., Mater. Sci. Eng. A, 302, 18 (2001).
A. Wirth et al., AMC 2003 Proc., MRS, 2004, p. 329.
Y. Zhu, K. Mimura, M. Isshiki, Mater. Trans. , 43, 2173 (2002).
Y.Z. Hu, R. Sharangpani, S.-P. Tay, J. Electrochem. Soc., 148, G669 (2001).
Z.L. Zhang, Z.G. **ao, G.W. Tu, Thin Sol. Films, 286, 295 (1996).
N.S. McIntyre et al., Surf. Interface Analysis, 15, 265, (1990).
R. Peraldi, D. Monceau, B. Pieraggi, Oxidation Met., 58, 275 (2002).
A.K. Stamper et al., AMC 2002 Proc., MRS, 2003, p. 485.
L. Sun, J.C. Yang, J. Mat. Res., 20, 1911 (2005).
S.B. Antonelli et al., J. Electrochem. Soc., 152, J120 (2005).
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Gambino, J., Ivanov, I., Mongeon, S. et al. Thermal Oxidation of Ni and Co Alloys Formed by Electroless Plating. MRS Online Proceedings Library 914, 509 (2005). https://doi.org/10.1557/PROC-0914-F05-09
Received:
Accepted:
Published:
DOI: https://doi.org/10.1557/PROC-0914-F05-09