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Decoration of copper cathodes by gold for electrocatalytic CO2 reduction in DMF medium

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Abstract

Sedimentation of gold on a copper surface via galvanic replacement (GR) method from (1–4)mM H[AuCl4] + 50 mM Bu4NClO4 solutions in DMF has been studied. It is shown that copper surface decoration (Cu + Au) occurs with the formation of Au nanofilms fragments (0.5 Wt%) and almost solid Au nanofilm (≥ 3.6 Wt%). The main factors influencing the controlled gold content on the copper surface are the concentration of H[AuCl4] and temperature. It was found that the reduction of CO2 on (Cu + Au) cathodes in DMF solutions occurs at higher current values compared to copper ones, and the cathode currents increases with increasing Au content. Thus, at E =  − 3.0 V, icathode = 10.9, 11.2 and 17.0 mA⋅cm−2 at Au content of 0.5, 0.8 and 3.6 Wt%, while on copper cathodes icathode = 6.0 mA⋅cm−2.

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Acknowledgements

This work was carried out with the partial financial support of the National Research Foundation of Ukraine. Agreement 2020.02/0309 (No 0120U105247 “Design of polyfunctional nanostructured mono- and bimetals with electrocatalytic and antimicrobial properties”.

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Authors and Affiliations

  1. Department of Chemistry and Technology of Inorganic Substances, Lviv Polytechnic National University, 12 Bandery, Lviv, 79013, Ukraine

    Orest Kuntyi, Galyna Zozulya, Mariana Shepida & Artur Mazur

  2. Department of Inorganic Chemistry, Ivan Franko National University of Lviv, 6 Kyryla i Mefodiya Str., Lviv, 79005, Ukraine

    Vasyl Kordan

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  1. Orest Kuntyi
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  2. Galyna Zozulya
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  3. Mariana Shepida
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Correspondence to Mariana Shepida.

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Kuntyi, O., Zozulya, G., Shepida, M. et al. Decoration of copper cathodes by gold for electrocatalytic CO2 reduction in DMF medium. Appl Nanosci 13, 7029–7035 (2023). https://doi.org/10.1007/s13204-023-02794-6

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  • DOI: https://doi.org/10.1007/s13204-023-02794-6

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