Structural, optical and electronic properties of oxidized AIN thin films at different temperatures

Abstract

We report on the properties of a novel insulator, AlO:N for application in semiconductors produced by thermally oxidizing AlN thin films. The process steps were similar to those used for SiO₂, creating the possibility of a new technology for metal-insulator-semiconductor field effect devices and integrated circuits. Thin films of AlN were deposited by radio-frequency magnetron reactive sputtering on p-type silicon or fused quartz substrates. As-deposited AlN film thickness ranged from 0.05 to 0.7 µm, with polycrystalline structure revealed by x-ray diffraction. Oxidation was performed under O₂ flow at 800 to 1100°C for 1–4 h. AlN films were oxidized partially or fully into Al₂O₃, depending on initial thickness, oxidation temperature and time. X-ray diffraction indicates the presence of several phases of Al₂O₃ at 1000°C, whereas at 1100°C, only the α-Al₂O₃ phase was found. Considering the importance of surface field effect device applications, the surfaces of oxidized films were examined with atomic force microscopy in air, and a clear change was observed in the surface structure of the oxidized film from that of as-deposited AlN films. Capacitance-voltage measurements of metal-oxide-semiconductor structures yielded a dielectric constant of AlO:N between 8–12 and a net oxide-trapped-charge density of ∼10¹¹ cm⁻². Using Fourier transform infrared spectrometry transmittance and reflectance, some α-Al₂O₃ modes were observed. In this paper, we describe the general properties of the oxide thin films, bulk and interface, at different temperatures.