SpringerLink
Log in

Influence of interfacial reaction layer on reliability of chip-scale package joint from using Sn-37Pb and Sn-8Zn-3Bi solder

  • Regular Issue Paper
  • Published:
Journal of Electronic Materials Aims and scope Submit manuscript

Abstract

The microstructure of Sn-37Pb and Sn-8Zn-3Bi solders and the full strength of these solders with an Au/Ni/Cu pad under isothermal aging conditions were investigated. The full strengths tended to decrease as the aging temperature and time increased, regardless of the properties of the solders. The Sn-8Zn-3Bi had higher full strength than Sn-37Pb. In the Sn-37Pb solder, Ni3Sn4 compounds and irregular-shaped Pb-rich phase were embedded in a β-Sn matrix. The Ni3Sn4 compounds were observed at the interface between the solder and pad. The microstructure of the as-reflowed Sn-8Zn-3Bi solder mainly consists of the β-Sn matrix scattered with Zn-rich phase. Zinc first reacted with Au and then was transformed to the AuZn compound. With aging, Ni5Zn21 compounds were formed at the Ni layer. Finally, a Ni5Zn21 phase, divided into three layers, was formed with column-shaped grains, and the thicknesses of the layers were changed.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Subscribe and save

Springer+ Basic
EUR 32.99 /Month
  • Get 10 units per month
  • Download Article/Chapter or Ebook
  • 1 Unit = 1 Article or 1 Chapter
  • Cancel anytime
Subscribe now

Buy Now

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. M. Abtew and G. Selvaduray, Mater. Sci. Eng. 27, 95 (2000).

    Article  Google Scholar 

  2. J. Glazer, J. Electron. Mater. 23, 673 (1994).

    Google Scholar 

  3. K. Zeng and K.N. Tu, Mater. Sci. Eng. 38, 55 (2002).

    Article  Google Scholar 

  4. Y. Kamiya and H. Houma, Fujitsu 54, 154 (2003).

    Google Scholar 

  5. P. Harris, Solder. Surf. Mount Technol. 11, 46 (1999).

    Article  CAS  Google Scholar 

  6. T. Shimozaki and M. Onishi, J. Jpn. Inst. Met. 42, 402 (1978).

    CAS  Google Scholar 

  7. T. Shimozaki and M. Onishi, J. Jpn. Inst. Met. 45, 1221 (1981).

    CAS  Google Scholar 

  8. K.H. Prakash and T. Shitharan, Acta Mater. 49, 2481 (2001).

    Article  CAS  Google Scholar 

  9. S.-P. Yu and M.-C. Wang, J. Mater. Res. 16, 76 (2001).

    CAS  Google Scholar 

  10. C.-M. Chen and S.-W. Chen, J. Electron. Mater. 29, 1222 (2000).

    Article  CAS  Google Scholar 

  11. M.Y. Chiu, S.S. Wang, and T.H. Chuang, J. Electron. Mater. 31, 494 (2002).

    Article  CAS  Google Scholar 

  12. K.S. Kim, J.M. Yang, C.H. Yu, and H.J. Jeon, Trans. JIM 45, 721 (2004).

    Article  CAS  Google Scholar 

  13. P.G. Kim, J.W. Jang, T.Y. Lee, and K.N. Tu, Jpn. J. Appl. Phys. 86, 6746 (1999).

    Article  CAS  Google Scholar 

  14. C.H. Yu and K.S. Kim, Trans. JIM 43, 3234 (2002).

    Article  CAS  Google Scholar 

Download references

Author information

Authors and Affiliations

  1. Optical Reliability Qualification Team, ETRI, 305-350, Daejeon, Korea

    Chung-Hee Yu

  2. Department of Electronic Engineering, Yeojoo Institute of Technology, 469-705, Yeojoo, Korea

    Kyung-Seob Kim

  3. Department of Mechanical Engineering, UCLA, 90005, Los Angeles, CA

    Hyung-Il Kim

  4. School of Mechanical Engineering, Chung-Ang University, 156-756, Seoul, Korea

    Hyo-Joeng Jeon

Authors
  1. Chung-Hee Yu
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Kyung-Seob Kim
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Hyung-Il Kim
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Hyo-Joeng Jeon
    View author publications

    You can also search for this author in PubMed Google Scholar

Rights and permissions

Reprints and permissions

About this article

Cite this article

Yu, CH., Kim, KS., Kim, HI. et al. Influence of interfacial reaction layer on reliability of chip-scale package joint from using Sn-37Pb and Sn-8Zn-3Bi solder. J. Electron. Mater. 34, 161–167 (2005). https://doi.org/10.1007/s11664-005-0228-9

Download citation

  • Received:

  • Accepted:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s11664-005-0228-9

Key words

Search

Navigation