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Medium Pressure Plasma Processing of Fused Silica: A Comparative Study for Material Removal Rate

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Abstract

The use of fused silica material is crucial in various scientific applications; however, its chemical inertness and brittle nature pose challenges to machining and fabrication processes. The present study introduced a dynamic plasma flow system for medium-pressure plasma processing of fused silica substrate to address this issue. The results indicate that the new plasma flow system can significantly enhance the material removal rate compared to existing systems, with a 300% increase in material removal rate. Importantly, this process enables a sustained linear material removal rate, essential for long process durations. Despite the higher material removal rate, there is no deterioration in surface finish observed, and in fact, an improvement in surface integrity is noted after plasma processing. Confocal Raman microscopy characterization further confirms this improvement, revealing reduced stress-induced defect peaks compared to a confined plasma system.

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Authors and Affiliations

  1. ISRO Inertial Systems Unit, Indian Space Research Organization, Thiruvananthapuram, India

    Enni Krishna, K. Sreelakshmy & D. Sam Dayala Dev

  2. Department of Mechanical Engineering, Indian Institute of Technology Guwahati, Assam, India

    Manas Das

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  1. Enni Krishna
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  2. K. Sreelakshmy
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  3. D. Sam Dayala Dev
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  4. Manas Das
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Contributions

EK: Conceptualization; Methodology; Writing—original draft preparation, SK: Formal analysis and investigation; SDDD: Resources; review and editing, MD: Supervision; review and editing.

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Correspondence to Manas Das.

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Krishna, E., Sreelakshmy, K., Dev, D.S.D. et al. Medium Pressure Plasma Processing of Fused Silica: A Comparative Study for Material Removal Rate. Plasma Chem Plasma Process 44, 1069–1082 (2024). https://doi.org/10.1007/s11090-023-10440-w

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  • DOI: https://doi.org/10.1007/s11090-023-10440-w

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