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Mechanical modeling and transient anti-plane fracture analysis for the graded inter-diffusion regions in a bonded structure

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Abstract

An inter-diffusion interface model (IDIM) is put forward for a bonded structure. Laplace and Fourier integral transforms are applied to reduce the transient anti-plane fracture problem of the structure as a Cauchy singular integral equation. Lobatto-Chebyshev collocation method and Laplace numerical inversion transform are employed to evaluate transient stress intensity factors (TSIFs). The effects of geometrical and physical parameters on TSIFs are studied. Specially discussed are the influences of the weak/micro-discontinuity of the interfaces. Comparison between IDIM and the graded interlayer model indicates that if the inter-diffusion between the two original materials is prominent, the former should be applied instead of the latter in fracture analyses of bonded structures.

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Authors and Affiliations

  1. Department of Mechanical Engineering, Academy of Armored Force Engineering, No. 21, Du Jia Kan, Chang **n Dian, Bei**g, 100072, P.R. China

    Yong-Dong Li

  2. School of Mechanical Engineering, Yonsei University, Seoul, 120-749, South Korea

    Yong-Dong Li & Kang Yong Lee

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  1. Yong-Dong Li
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  2. Kang Yong Lee
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Correspondence to Kang Yong Lee.

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Li, YD., Lee, K.Y. Mechanical modeling and transient anti-plane fracture analysis for the graded inter-diffusion regions in a bonded structure. Meccanica 44, 389–408 (2009). https://doi.org/10.1007/s11012-008-9175-x

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  • DOI: https://doi.org/10.1007/s11012-008-9175-x

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