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A 220-GHz 110-mW Solid-State Power Combining Amplifier Based on Novel E-Plane Waveguide Magic-T

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Abstract

This paper designs a novel E-plane waveguide magic-T in 220 GHz and develops a high-power solid-state power amplifier (SSPA) operating at 210–230 GHz in combination with eight InP high electron mobility transistor terahertz monolithic integrated circuits (TMICs). The 8-way divider-combiner network is composed of low-loss WR-4 novel E-plane waveguide magic-T. The matching load of waveguide magic-T is the air outside the waveguide module, which is connected to the pyramidal horn antenna of WR-4 waveguide to WR-10 waveguide. A monolithically integrated dipole-to-waveguide transition eliminates the need for wirebonding and additional substrates. The low-loss corporate power combining and low-loss dipole-to-waveguide transition achieve high-power combining efficiency of SSPA. The hydroxyl-iron is placed in the upper cavity of TMIC to prevent the cavity from resonance. The SSPA module demonstrated small-signal gain \(\ge\) 10 dB from 210 to 229 GHz. The saturated output power was \(>\) 100 mW from 215 to 227 GHz and peak output power of 110 mW with 83% power combining efficiency at 220 GHz.

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References

  1. H. -J. Song and T. Nagatsuma, Present and future of terahertz communications, IEEE Transactions on Terahertz Science and Technology, vol. 1, no. 1, pp. 256-263, Sept. 2011.

    Article  Google Scholar 

  2. P. Huang, R. Lai, R.Grundbacher and B. Gorospe, A 20-mW G-band monolithic driver amplifier using 0.07-μm InP HEMT, 2006 IEEE MTT-S International Microwave Symposium Digest, San Francisco, CA, USA, 2006, pp. 806-809.

  3. M.Ćwikliński et al., First demonstration of G-band broadband GaN power amplifier MMICs operating beyond 200 GHz, 2020 IEEE/MTT-S International Microwave Symposium (IMS), Los Angeles, CA, USA, 2020, pp. 1117-1120.

  4. Z. Griffith, M.Urteaga, P. Rowell and R. Pierson, A 23.2dBm at 210GHz to 21.0dBm at 235GHz 16-way PA-cell combined InP HBT SSPA MMIC, 2014 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS), La Jolla, CA, USA, 2014, pp. 1-4.

  5. V.Radisic et al., A 50 mW 220 GHz power amplifier module, 2010 IEEE MTT-S International Microwave Symposium, Anaheim, CA, USA, 2010, pp. 45-48.

  6. F. Thome and A. Leuther, A 75–305-GHz power amplifier MMIC with 10–14.9-dBm Pout in a 35-nm InGaAs mHEMT technology, IEEE Microwave and Wireless Components Letters, vol. 31, no. 6, pp. 741-743, June 2021.

    Article  Google Scholar 

  7. J. -M. Rollin, D. Miller, M.Urteaga, Z. M. Griffith and H. Kazemi, A Polystrata® 820 mW G-band solid state power amplifier, 2015 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS), New Orleans, LA, USA, 2015, pp. 1-4.

  8. K. W. Brown, D. M.Gritters and H. Kazemi, W- and G-band solid state power combining, 2015 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS), New Orleans, LA, USA, 2015, pp. 1-4.

  9. K. J. Russell, Microwave power combining techniques, IEEE Transactions on Microwave Theory and Techniques, vol. 27, no. 5, pp. 472-478, May 1979.

    Article  Google Scholar 

  10. F. Takeda, O.lshida and Y. Isoda, Waveguide power divider using metallic septum with resistive coupling slot, 1982 IEEE MTT-S International Microwave Symposium Digest, Dallas, TX, USA, 1982, pp. 527-528.

  11. L. W. Epp, D. J. Hoppe, A. R. Khan and S. L. Stride, A high-power Ka-band (31–36 GHz) solid-state amplifier based on low-loss corporate waveguide combining, IEEE Transactions on Microwave Theory and Techniques, vol. 56, no. 8, pp. 1899-1908, Aug. 2008.

    Article  Google Scholar 

  12. Q. -X. Chu, Q. -S. Wu and D. -Y. Mo, A Ka-band E-plane waveguide magic-T with coplanar arms, IEEE Transactions on Microwave Theory and Techniques, vol. 62, no. 11, pp. 2673-2679, Nov. 2014.

    Article  Google Scholar 

  13. Z. Xu, J. Xu, Y. Cui and C. Qian, A novel rectangular waveguide T-junction for power combining application, IEEE Microwave and Wireless Components Letters, vol. 25, no. 8, pp. 529-531, Aug. 2015.

    Article  Google Scholar 

  14. A. Gouda, C. D. López, V. Desmaris, D. Meledin, A. B. Pavolotsky and V. Belitsky, Millimeter-wave wideband waveguide power divider with improved isolation between output ports, IEEE Transactions on Terahertz Science and Technology, vol. 11, no. 4, pp. 408-416, July 2021.

    Article  Google Scholar 

  15. H. Rashid, D. Meledin, V. Desmaris and V. Belitsky, Novel waveguide 3 dB hybrid with improved amplitude imbalance, IEEE Microwave and Wireless Components Letters, vol. 24, no. 4, pp. 212-214, April 2014.

    Article  Google Scholar 

  16. D. L. Ingram et al., Compact W-band solid-state MMIC high power sources, 2000 IEEE MTT-S International Microwave Symposium Digest (Cat. No.00CH37017), Boston, MA, USA, 2000, pp. 955–958 vol.2.

  17. Hui-Wen Yao, A. Abdelmonem, Ji-Fuh Liang and K. A. Zaki, A full wave analysis of microstrip-to-waveguide transitions, 1994 IEEE MTT-S International Microwave Symposium Digest (Cat. No.94CH3389–4), San Diego, CA, USA, 1994, pp. 213–216 vol.1.

  18. J. H. C. VanHeuven, A new integrated waveguide-microstrip transition, 1974 4th European Microwave Conference, Montreux, Switzerland, 1974, pp. 541-545.

  19. Yoke-Choy Leong and S. Weinreb, Full band waveguide-to-microstrip probe transitions, 1999 IEEE MTT-S International Microwave Symposium Digest (Cat. No. 99CH36282), Anaheim, CA, USA, 1999, pp. 1435–1438 vol.4.

  20. E. Daniel et al., Packaging of microwave integrated circuits operating beyond 100 GHz, Proceedings. IEEE Lester Eastman Conference on High Performance Devices, Newark, DE, USA, 2002, pp. 374–383.

  21. A.Tessmann et al., A 600 GHz low-noise amplifier module, 2014 IEEE MTT-S International Microwave Symposium (IMS2014), Tampa, FL, USA, 2014, pp. 1-3.

  22. L. Samoska et al., A submillimeter-wave HEMT amplifier module with integrated waveguide transitions operating above 300 GHz, IEEE Transactions on Microwave Theory and Techniques, vol. 56, no. 6, pp. 1380-1388, June 2008.

    Article  Google Scholar 

  23. K. M. K. H. Leong et al., A 340–380 GHz integrated CB-CPW-to-waveguide transition for sub millimeter-wave MMIC packaging, IEEE Microwave and Wireless Components Letters, vol. 19, no. 6, pp. 413-415, June 2009.

    Article  Google Scholar 

  24. V. Radisic, K. M. K. H. Leong, X. Mei, S. Sarkozy, W. Yoshida and W. R. Deal, Power amplification at 0.65 THz using InP HEMTs, IEEE Transactions on Microwave Theory and Techniques, vol. 60, no. 3, pp. 724-729, March 2012.

    Article  Google Scholar 

  25. V. Radisic et al., 220-GHz solid-state power amplifier modules, IEEE Journal of Solid-State Circuits, vol. 47, no. 10, pp. 2291-2297, Oct. 2012.

    Article  Google Scholar 

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Funding

The work for this grant was supported by the National Natural Science Foundation of China (Grant no.: 62071089).

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Authors and Affiliations

  1. University of Electronic Science and Technology of China, Chengdu, China

    Yuanbo Ma & Mingzhou Zhan

  2. Hebei **ong’an Taixin Electronic Technology Co., Ltd, Baoding City, Hebei, China

    Jian Cao

Authors
  1. Yuanbo Ma
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  2. Jian Cao
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  3. Mingzhou Zhan
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Contributions

YM and MZ wrote the main manuscript text. CJ provided InP HEMT terahertz monolithic integrated circuits (TMICs) and measured the solid-state power amplifier and prepared the figures of measured results in the paper.

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Correspondence to Mingzhou Zhan.

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Ma, Y., Cao, J. & Zhan, M. A 220-GHz 110-mW Solid-State Power Combining Amplifier Based on Novel E-Plane Waveguide Magic-T. J Infrared Milli Terahz Waves 44, 491–502 (2023). https://doi.org/10.1007/s10762-023-00920-7

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