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/cm2 dose of As ions followed by both isochronal and isothermal annealing. The elementary defects generated first during solid-phase epitaxial recovery of implantation-induced amorphous layers at temperatures of 550 °C and/or 600 °C are {311} defects 2–3 nm long. They are considered to be transformed into {111} and {100} defects after annealing at temperatures higher than 750 °C. These secondary defects show the opposite annealing behavior to the dissolution and growth by the difference of their depth positions at 800 °C. This phenomenon is explained by the diffusion of self-interstitials contained in defects. With regard to the formation and dissolution of defects, there is no significant difference between the effects of rapid thermal annealing (950 °C for 10 s) and furnace annealing (800 °C for 10 min).
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Received: 14 November 1997/Accepted: 16 November 1997
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Tamura, M., Hiroyama, Y., Nishida, A. et al. Secondary defects in low-energy As-implanted Si . Appl Phys A 66, 373–384 (1998). https://doi.org/10.1007/s003390050681
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DOI: https://doi.org/10.1007/s003390050681