Log in

Theoretical and experimental study on localization improvement in ultrasonic vibration–assisted spark-assisted electrochemical drilling process

  • ORIGINAL ARTICLE
  • Published:
The International Journal of Advanced Manufacturing Technology Aims and scope Submit manuscript

Abstract

Spark-assisted electrochemical machining (SAEM) is an advanced machining method, which can manufacture microstructures on non-conductive hard and brittle materials such as glass. However, there are still some technological problems in the process of SAEM, among which the poor machining localization and the damage of microhole outlet are still unresolved. In order to improve the localization and quality of machining, a method of ultrasonic vibration–assisted spark-assisted electrochemical drilling (UASAED) was proposed in this paper. The application of ultrasonic vibration can reduce the gas film thickness and improve its stability in the spark-assisted electrochemical machining process, and reduce the discharge energy, so the machining localization and quality can be improved. Firstly, the formation of gas film in the drilling process was simulated and the influence of ultrasonic vibration on the gas film was analyzed. Secondly, the mechanism of material removal during drilling process was studied and simulated, and the mathematical model was established. Then, through a series of experiments, according to the established mathematical model, the relationships between the key machining parameters and the machining localization were studied, and the experimental results were consistent with the simulation. Finally, according to the machining parameters optimized by single factor experiments, 4 × 5 high-quality glass microhole array was successfully machined. The diameters of microholes were significantly reduced, with the inlet diameter decreasing by 20.59% and the outlet diameter by 14.9%, which indicated that ultrasonic vibration–assisted spark-assisted electrochemical drilling is an effective method to improve the machining localization.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Subscribe and save

Springer+ Basic
EUR 32.99 /Month
  • Get 10 units per month
  • Download Article/Chapter or Ebook
  • 1 Unit = 1 Article or 1 Chapter
  • Cancel anytime
Subscribe now

Buy Now

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9
Fig. 10
Fig. 11
Fig. 12
Fig. 13
Fig. 14
Fig. 15
Fig. 16
Fig. 17
Fig. 18
Fig. 19
Fig. 20
Fig. 21
Fig. 22
Fig. 23
Fig. 24

Similar content being viewed by others

Availability of data and material

All data generated or analyzed during this study are included within the article.

Code availability

Not applicable.

References

  1. Chang W, Hsihe Y (2016) Multilayer microheater based on glass substrate using MEMS technology. Microelectron Eng 149:25–30

    Article  Google Scholar 

  2. Hof LA, Ziki JA (2017) Micro-hole drilling on glass substrates-a review. Micromachines 8(2):53

    Article  Google Scholar 

  3. Lee J, Lee S, Lee S, Park J (2013) Through-glass copper via using the glass reflow and seedless electroplating processes for wafer-level RF MEMS packaging. J Micromech Microeng 23(8):85012

    Article  Google Scholar 

  4. Kannojia HK, Arab J, Pegu BJ, Dixit P (2019) Fabrication and characterization of through-glass vias by the ECDM process. J Electrochem Soc 166(13):D531-538

    Article  Google Scholar 

  5. Khan AA, Haque MM (2007) Performance of different abrasive materials during abrasive water jet machining of glass. J Mater Process Technol 191(1):404–407

    Article  Google Scholar 

  6. Ahmed N, Darwish S, Alahmari AM (2016) Laser ablation and laser-hybrid ablation processes: a review. Mater Manuf Processes 31(9):1121–1142

    Article  Google Scholar 

  7. Lv D, Wang H, Tang Y, Huang Y, Li Z (2013) Influences of vibration on surface formation in rotary ultrasonic machining of glass BK7. Precis Eng 37(4):839–848

    Article  Google Scholar 

  8. Iliescu C, Chen B, Miao J (2008) On the wet etching of Pyrex glass. Sens Actuators, A 143(1):154–161

    Article  Google Scholar 

  9. Singh T, Dvivedi A (2016) Developments in electrochemical discharge machining: a review on electrochemical discharge machining, process variants and their hybrid methods. Int J Mach Tools Manuf 105:1–13

    Article  Google Scholar 

  10. Torabi A, Razfar MR (2021) The capability of ECDM in creating effective microchannel on the PDMS. Precis Eng 68:10–19

    Article  Google Scholar 

  11. Kurafugi H, Suda H (1968) Electrical discharge drilling of glass. CIRP Ann Manuf Technol 16(1)

  12. Zou R, Yu Z, Yan C, Li J, Liu X, Xu W (2018) Micro electrical discharge machining in nitrogen plasma jet. Precis Eng 51:198–207

    Article  Google Scholar 

  13. Spieser A, Ivanov A (2013) Recent developments and research challenges in electrochemical micromachining (µECM). Int J Adv Manuf Technol 69(1–4):563–581

    Article  Google Scholar 

  14. Huang L, Cao Y, Jia F, Lei Y (2020) Study on the stability of gas film in electrochemical discharge machining of ultra-white glass micro array holes. Microsyst Technol 26(3):947–955

    Article  Google Scholar 

  15. Rathore RS, Dvivedi A (2020) Sonication of tool electrode for utilizing high discharge energy during ECDM. Mater Manuf Processes 35(4):415–429

    Article  Google Scholar 

  16. Wüthrich R, Hof LA (2006) The gas film in spark assisted chemical engraving (SACE)—a key element for micro-machining applications. Int J Mach Tools Manuf 46(7):828–835

    Article  Google Scholar 

  17. Pawariya K, Dvivedi A, Singh T (2019) On performance enhancement of electrochemical discharge trepanning (ECDT) process by sonication of tool electrode. Precis Eng 56:8–19

    Article  Google Scholar 

  18. Tricarico C, Delpretti R, Dauw DF (1988) Geometrical simulation of the EDM die-sinking process. CIRP Ann 37(1):191–196

    Article  Google Scholar 

  19. Marafona J, Chousal JAG (2006) A finite element model of EDM based on the Joule effect. Int J Mach Tools Manuf 46(6):595–602

    Article  Google Scholar 

  20. Jui SK, Kamaraj AB, Sundaram MM (2013) High aspect ratio micromachining of glass by electrochemical discharge machining (ECDM). J Manuf Process 15(4):460–466

    Article  Google Scholar 

  21. Cheng C, Wu K, Mai C, Hsu Y, Yan B (2010) Magnetic field-assisted electrochemical discharge machining. J Micromech Microeng 20(7):075019

    Article  Google Scholar 

  22. Han M, Min B, Lee SJ (2007) Improvement of surface integrity of electro-chemical discharge machining process using powder-mixed electrolyte. J Mater Process Technol 191(1):224–227

    Article  Google Scholar 

  23. Singh T, Dvivedi A (2018) On pressurized feeding approach for effective control on working gap in ECDM. Mater Manuf Processes 33(4):462–473

    Article  Google Scholar 

  24. Arab J, Mishra DK, Kannojia HK, Adhale P, Dixit P (2019) Fabrication of multiple through-holes in non-conductive materials by electrochemical discharge machining for RF MEMS Packaging. J Mater Process Technol 271:542–553

    Article  Google Scholar 

  25. Kolhekar KR, Sundaram M (2018) Study of gas film characterization and its effect in electrochemical discharge machining. Precis Eng 53:203–211

    Article  Google Scholar 

  26. Han M, Min B, Lee SJ (2009) Geometric improvement of electrochemical discharge micro-drilling using an ultrasonic-vibrated electrolyte. J Micromech Microeng 19(6):065004

    Article  Google Scholar 

  27. Rusli M, Furutani K (2012) Performance of micro-hole drilling by ultrasonic-assisted electro-chemical discharge machining. Adv Mater Res 445:865–870

    Article  Google Scholar 

  28. Elhami S, Razfar MR (2018) Effect of ultrasonic vibration on the single discharge of electrochemical discharge machining. Mater Manuf Processes 33(4):444–451

    Article  Google Scholar 

  29. Chang W, Chen Y, Zhang J, Gu X, Fang M (2015) Ultrasonic vibration aided electrical-discharge milling flow field and debris distribution field simulation. J Basic Sci Eng 23:151–157

    Google Scholar 

  30. Klausner JF, Mei R, Bernhard DM, Zeng LZ (1993) Vapor bubble departure in forced convection boiling. Int J Heat Mass Transfer 36(3):651–662

    Article  Google Scholar 

Download references

Funding

Financial support was received from the National Key R&D Program of China (No. 2018YFB2001400), the National Natural Science Foundation of China (No. 52005298), the Natural Science Foundation of Shandong Province (No. ZR2021ME048), and the Key R&D Program of Shandong Province (No. 2019GGX104023), and this work is also supported by Physical–Chemical Materials Analytical & Testing center of Shandong University at Weihai.

Author information

Authors and Affiliations

Authors

Contributions

Yong Liu contributed to the conception of the study; Tianbo Wang performed the experiment, contributed significantly to analysis and manuscript preparation, performed the data analyses, and wrote the manuscript; others helped perform the analysis with constructive discussions.

Corresponding author

Correspondence to Yong Liu.

Ethics declarations

Ethics approval

Compliance with ethical standards.

Consent to participate

All authors agreed with the consent to participate.

Consent for publication

All authors have read and agreed to the publication of the paper.

Competing interests

The authors declare no competing interests.

Additional information

Publisher's Note

Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Wang, T., Liu, Y., Lv, Z. et al. Theoretical and experimental study on localization improvement in ultrasonic vibration–assisted spark-assisted electrochemical drilling process. Int J Adv Manuf Technol 121, 5311–5328 (2022). https://doi.org/10.1007/s00170-022-09642-x

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s00170-022-09642-x

Keywords

Navigation