Abstract
The surface properties (water sorption and repellency, adhesion) are closely related to the surface tension of polymer solids. The critical surface tension (γ c ) and surface tension (γ s ) of a polymer solid were estimated by the contact angle method by our quantitative imaging system. BPDA (3,3′,4,4′-biphenyl tetracarboxylic dianhydride)-BAPP (1,3-Bis(4-aminophenoxy) propane) polyimide was successfully synthesized. Theγ c values were analyzed by a Zisman plot, a Young-Dupré-Good-Girifalco plot, and a log (1+cos θ) vs logγ L plot. Theγ s value of BPDA-BAPE polyimide was evaluated using the geometric mean equation and our multiple regression analysis. The calculated values ofγ d S (a dispersion component),γ p S (a polar component),γ h S (a hydrogen bonding component), andγ S were 30.79, 9.32, 0.20, and 40.31 mN·m-1, respectively. Theγ S of BPDA-BAPP polyimide containing both a methylene group and an ether group was larger than that of the polyimide containing only a methylene group.
Similar content being viewed by others
References
W. S. Ruska,Microelectronic Processing: An Introduction to the Manufacture of Integrated Circuits, McGraw-Hill, New York, 1987, pp 68–76.
A. Endo, M. Takada, K. Adachi, H. Takasago, T. Yada, and Y. Onishl,J. Electrochem. Soc.: Solid-State Sci. Tech.,34, 2522 (1987).
K. L. Mittal,Polyimides: synthesis, characterization, and applications, Plenum Press, New York, 1984.
C. Feger, M. M. Khojasteh, and M. S. Htoo,Advances in polyimide science and technology, Technomic Publications, Lancaster, 1993.
C. E. Sroog,J. Polym. Sci.: Macromol. Rev.,11, 161 (1979).
A. M. Wilson,Use of Polyimides in VLSI fabrication, in Polyimides, 1st ed., K. L. Mittal, Ed., Plenum Press, New York, 1984, pp 715–733.
A. M. Wilson,Thin Solid Films,83, 145 (1981).
E. Sacher and J. R. Susko,J. Appl. Polym. Sci.,26, 679 (1981).
M. Ree, M. J. Goldberg, G. Czornyj, H. S. Han, and C. C. Gryte,Polym. Mater. Sci. Eng.,68, 126 (1993).
D. H. Lee,Polymer(Korea),11, 206 (1987).
F. Belluchi, I. Khamis, S. D. Senturia, and R. M. Lantanison,J. Electrochem. Soc.,137, 1778 (1990).
B. S. Kim, S. H. Bae, Y. H. Park, and J.-H. Kim,Macromol. Res.,15, 357 (2007).
A. S. Mathew, I. Kim, and C. S. Ha,Macromol. Res.,15, 114 (2007).
H. S. Lee, A. Roy, A. S. Badami, and J. E. McGrath,Macromol. Res.,15, 160 (2007).
H. S. Han, Ph. D. Thesis, Columbia University, New York, 1993.
D. D. Denton, D. R. Day, D. F. Priore, and S. D. Senturia,J. Electron. Mater.,14, 119 (1985).
J. Melcher, Y. Deben, and G. Arlt,IEEE Elecrt. Insul.,24, 31 (1989).
E. Sacherand and J. R. Sucko,J. Appl. Polym. Sci.,23, 2355 (1979).
H. J. Merrem, R. Klug, and H. Hartner,New Developments in Photosensitive Polyimide, in Polyimides, 2nd ed., K. L. Mittal, Ed., Plenum Press, New York, 1989, pp 919–931.
E. Tchangai, Y. Segui, and K. Doukkali,J. Appl. Polym. Sci.,38, 305 (1989).
J.-H. Jou, R. Huang, P.-T. Huang, and W.-P. Shen,J. Appl. Polym. Sci.,43, 857 (1991).
Y. Kwon and K.-H. Kim,Macromol. Res.,14, 424 (2006).
M. Ree,Macromol. Res.,14, 1 (2006).
S. J. Shin, J. H. Chi, W. C. Zin, T. Chang, M. Ree, and J. C. Jung,Polymer(Korea),30, 97 (2006).
M. Ree, T. J. Shin, and S. W. Lee,Korea Polym. J.,9, 1 (2001).
M. Ree, T. J. Shin, Y. H. Park, H. Lee, and T. Chang,Korea Polym. J.,7, 370 (1999).
W. H. Goh, K. Kim, and M. Ree,Korea Polym. J.,6, 241 (1998).
H. Han and M. Ree,Korea Polym. J.,5, 152 (1997).
H. W. Fox and W. A. Zisman,J. Colloid Sci.,5, 514 (1950).
R. E. Johnson and R. H. Dettre,J. Colloid Sci.,20, 73 (1965).
A. M. Gaudin,Flotation, McGraw-Hill, New York, 1957, p. 163.
A. W. Adams, F. P. Shirley, and K. T. Kunichika,J. Colloid Interf. Sci.,34, 461 (1970).
T. Fort and H. T. Patterson,J. Colloid Sci.,18, 217 (1963).
Y. Kitazaki and T. J. Hata,J. Adhes. Soc. Jpn.,8, 131 (1972).
Y. Kano and S. Akiyama,Polymer,33, 1690 (1992).
H. W. Fox and W. A. Zisman,J. Colloid Sci.,7, 109 (1952a).
H. W. Fox and W. A. Zisman,J. Colloid Sci.,7, 428 (1952b).
A. Zisman, inTreaties on Contact Angle, Wettability and Adhesion, Advances in Chemistry Series, American Chemical Society, Washington DC, 1964, No. 43, pp 1–51.
F. M. Fowkes, inTreaties on Contact Angle, Wettability and Adhesion, Advances in Chemistry Series, American Chemical Society, Washington DC, 1964, No. 43, pp 99–111.
R. J. Good, inTreaties on Contact Angle, Wettability and Adhesion, Advances in Chemistry Series, American Chemical Society, Washington DC, 1964, No. 43, pp 74–87.
R. J. Good, inTreaties on Adhesion and Adhesive, R. L. Patrick, Ed., Marcel Dekker, New York, 1967, Vol. 1, pp 9–68.
R. J. Good and L. A. Girifalco,J. Phys. Chem.,64, 561 (1960).
Y. Kano and T. Saito,Setchaku,32, 396 (1988).
S. Wu,Polymer Interface and Adhesion, Marcel Dekker, New York, 1982a, p 105.
D. H. Kaelble and K. C. Uy,J. Adhes.,2, 51 (1970).
S. Wu,Polymer Interface and Adhesion, Marcel Dekker, New York, 1982b, pp 257–259.
A. W. Adamson,Physical Chemistry of Surfaces, 5th ed., John Wiley & Sons, New York, 1990a, pp 389–392.
M. K. Ghosh and K. L. Mittal,Polyimides: Fundamentals and Applications, Marcel Dekker, New York, 1996, pp 16–18.
S. Wu,Polymer Interface and Adhesion, Marcel Dekker, New York, 1982c, p. 162.
S. Wu,Polymer Interface and Adhesion, Marcel Dekker, New York, 1982d, p. 183.
A. W. Adamson,Physical Chemistry of Surfaces, 5th ed., John Wiley & Sons, New York, 1990b, pp 397–398.
W. Gutowski,J. Adhes.,19, 29 (1985).
K.-H. Kim and Y. Kwon,J. Chem. Eng. Jpn.,38, 641 (2005)
K.-H. Kim, Y.-G. Kim, and Y. Kwon,Mol. Cryst. Liq. Cryst.,470, 145 (2007).
J. Brandrup and E. H. Immergut,Polymer Handbook, 3rd ed., Wiley-Interscience, John Wiley & Sons, New York, 1989, p VI/422.
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Kim, KH., Kim, YG. & Kwon, Y. Preparation and characterization of surface energy of BPDA-BAPP polyimide. Macromol. Res. 17, 388–396 (2009). https://doi.org/10.1007/BF03218879
Received:
Revised:
Accepted:
Issue Date:
DOI: https://doi.org/10.1007/BF03218879